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Wafer Singulation: Inline: ecoSplit™I

Wafer Separation from the sawn stack into 5-8 tracks for inline wafer processing.

The System
The function of the wafer stack splitter is to automatically separate single wafers from the sawn stack. The sawn and pre-cleaned stack is separated manually into short stacks before loading into the ecoSplit™I for safe and fast single wafer separation. After separating the single wafers are lined up for simultaneous inline transfer to the cleaner module interface automatically. A sprinkler system is used throughout the system to prevent the wafers from drying out during the entire process.

The Technology
The splitter uses a gentle ‘dealing’ technique to separate wafers from the bottom of the stack. This patented handling technology has been carefully researched, developed and proven to provide a fast, safe and stress-free method of separation which is unique without prior knowledge of the handling materials and precise control techniques.

ROI
We can demonstrate to you that ecoSplit™ system is the most cost effective system on the market with a very fast Return of Investment. This is due to its low cost, highest throughput and lowest breakage rates.

Contact us if you need an evaluation using your wafers including a demonstration on how the ROI can work for you.

 

For further information contact us

 
 
     
 
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