Wafer Separation from the sawn stack to ecoCarrier™
The function of the wafer stack splitter is to automatically
separate single wafers from the sawn stack. The sawn
and pre-cleaned stack is separated manually into short
stacks before loading into the ecoSplit™C for
safe and fast single wafer separation. The single
wafers are then transported to the carrier station.
Empty carriers are loaded into the carrier station
automatically and are indexed slot-by-slot to accept
each split wafer from the transport system. When full,
the carrier is sent to the output station for unloading.
For loading and unloading the operator is alerted
to the status by the control interface and a remote
visual indicator. A sprinkler system is used throughout
the system to prevent the wafers from drying out during
the entire process.
The splitter uses a gentle ‘dealing’ technique
to separate wafers from the bottom of the stack. This
patented handling technology has been carefully researched,
developed and proven to provide a fast, safe and stress-free
method of separation which is unique without the prior
knowledge of the handling materials and precise control
techniques engineered into the machine.
We can demonstrate to you that ecoSplit™ system
is the most cost effective system on the market with
a very fast Return of Investment. This is due to its
low cost, highest throughput and lowest breakage rates.
Contact us if you need an evaluation using your
wafers including a demonstration on how the ROI can
work for you.
For safe and fast bench-top
unloading of wafers from the ecoCarrier™
This unique solution from ACI provides a high reliable but still simple solution
to unload carriers. The ACI ecoCUDe™ is a manually operated desk-top
device to unload wafers or cells from a wet bench carrier (e.g. ACI ecoCarrier™)
using a very efficient and safe method. For unloading, an ecoCarrier™ is
locked onto the ecoCUDe™, the wafers or cells are then manually pushed-out
in sub-sets of 20-25 pieces. The pushed-out wafers or cells can easily be
picked up by hand and manually transferred to the next process (e.g. inspection
With a throughput of up to 30 carriers per hour and with very low breakage
rates, this device is a very cost effective investment for your wafer production.
The ACI ecoCUDe™ uses a gentle “pushing” technique to manually
unload wafers or cells from a carrier. This process has been carefully developed
and proven to provide a fast and safe method for manual carrier unloading.
For further information contact